Thermodynamics questions~~pls
Please solve for the CPU temperature (TCPU) and its enclosure air temperature (Tenclosure) of the server computer by the case of force convection. The characteristic curve of fan as well as the resistance curve of the thermal module (include heat sink and spreader) is on the following. The other specifications are shown as following:
(A)
1. CPU: 2 * Xeon E5-2600, 100 W (each 50 W), the size is 11.3 X 11 X 0.77 (unit:
mm)
2. Power : 131 W, the size is 140 X 85 X 427 (unit: mm)
3. Hard Disk : 15* HD, 225 W (15 W)each, the size is 101.6 X 26.1 X 147 (unit: mm)
4. RAM (128G): 64W (each 4 W), the size is 1.6 X 30 X 134 (unit: mm)
5. Room temperature Ta=25℃
6. Size of the sever (W*H*D) : 173 X 459 X 685 mm3
7. Thickness of the server frame: 2mm, material: Stainless Steel, K value: 16 W/m,K
8. Maximum volumetric fan flow rate: 112 CFM (Fig. 2), the thermal resistance of
thermal module (CPU cooler: include spreader, sink and fan) is 0.4 ℃/W
9. Forget the effect of T.I.M. between CPU and thermal cooler
Hint: Tenclosure temperature is need to be solved first, which also will be the ambient temperature of the CPU chip
(B)
1. All the data are the same as in part (A) except item 9.
2. Item (8) for the fan curve is shown as in Fig.2, but there is no experiment data for the heat sink resistance curve, and no experiment thermal resistance data of the heat sink either. However, the geometric size is shown in Fig. 3, the flow is top down
Hint: You are asking to evaluate the heat sink resistance curve and the thermal resistance of the heat sink first, and then to calculate the Tenclosure temperature secondary
(C)
1. All the data are the same as in part (B) except the flow is side-blown without any lid
(D)
1. All the data are the same as in part (B) except the flow is side-blown with lid
(E) Please solve for the CPU temperature (TCPU) of the server based on the heat sink Fig. 3 by the case of natural convection
