A product with 400 die per wafer has an average die yield of 60% and a die area of 0.5 cm 2. The best die yield is observed near the center of a stacked wafer map is 82% and this yield occurs at two die sites. The stack included 750 wafers believed not be involved in any temporal yield excursions. (a) (6 points) Estimate the stationary baseline random yield (i.e., the yield when systematic losses are not present), and estimate the systematic mechanisms limited yield. (b) 2 points) Determine the Poisson defect density equivalent to the stationary baseline random yield. (c) (12 points) The following systematic mechanisms have been identified: NOTE: These three yield loss mechanisms are NOT mutually exclusive, e.g., an edge die may experience missing photo patterns and/or excessive particles. How much systematic yield loss is occurring from mechanisms not listed above?
